BGA Technology

 

There are two major keys to successful implementation of BGA Technology - correct design and a committed contract manufacturer.

It is therefore very important to choose a manufacturing partner who has invested in the correct equipment and skills required for handling this technology.

Let Cemgraft manage your PCB design with our design partners and assemble your BGA product on our precision production lines, using X-Ray Inspection to ensure each joint is perfect. We can remove, reball and replace BGAs with our ERSA rework station, so any worries about the cost of development using BGA Technology are removed.


Cemgraft has full BGA and micro-BGA capabilities including in-house X-Ray, Rework and
Re-Balling facilities.

Our investment includes:

8 Juki Surface Mount placement Lines offering placement to 0201, 10 thou QFPs, BGA and Micro BGA components
X-Tek iXS-3 X-Ray Chamber - with Image Capture and Data Logging
ERSASCOPE Inspection systems with Variable Magnification and Image Capture
ERSA Rework Station with Laser Alignment
Wimslow Re-Balling Station


More than 60% of our customers use BGA Technology

 


 
 
 
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