SMT Technology
5 Fully Automated SMT production Lines placing in excess of
80,000+ components per hour
SMT PCB Assembly – to 0201 and 10 thou QFPs
Camera Controlled in-line Solder Paste Printing on all 4 Production
Lines
Lead Forming and Cropping of QFPs
and SOICS
Double-sided Full force Convection
Reflow Ovens
The ability to handle large PCBs up to 460 x 460 mm (18” x
18”)
BGA
BGA and Micro-BGA placement
In-House X-Ray Chamber
Ersa Inspection systems
Re-Balling facilities |
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General Assembly
The ability to handle large PCBs up to 460 x 460 mm (18” x 18”)
Mixed Technology & Conventional Assembly
Wave Soldering
No Clean and Aqueous Wash processes
Encapsulation & Conformal Coating
Potting
Press-fitting
Cable Harnessing & Looming
Test & Diagnostics
In-Circuit Test (Analogue and Digital)
Boundary Scan, J-Tag
Automated Functional Test
Teradyne Spectrum 8800 and J-Tag Boundary Scan
Combination Testing
Manual Functional Testing
pc driven, switching, simulation and substitution
RF Testing
MDA (Manufacturing Defect Analysis)
Safety Testing |